Fabricantes
características principales 16GB (2 x 8GB) Capacity 3600 MHz Clock Speed PC4-28800 288-Pin UDIMM 1.35V 17-21-21 Timings Heat Spreader XMP 2.0 Support
características principales 16GB (2 x 8GB) Capacity 3200 MHz Clock Speed PC4-25600 288-Pin UDIMM 1.2V @ 2400 MHz | 1.35V @ 3200 MHz CL 16-18-18 Timings Unbuffered, Non-ECC Integrated Heat Spreader Support for Intel XMP 2.0 AMD Ryzen Ready
características principales 32GB (2 x 16GB) Capacity 3200 MHz Clock Speed PC4-25600 288-Pin UDIMM 1.2V @ 2400 MHz | 1.35V @ 3200 MHz CL 16-18-18 Timings Unbuffered, Non-ECC Integrated Heat Spreader Support for Intel XMP 2.0 AMD Ryzen Ready
características principales 500GB Capacity 3500 MB/s Maximum Read Speed 2100 MB/s Maximum Write Speed PCIe 4.0 x4 NVMe Interface M.2 2280 Form Factor
características principales 32GB (2 x 16GB) Capacity 2666 MHz Clock Speed PC4-21300 260-Pin SO-DIMM 1.2V 15-17-17 Timings Unbuffered, Non-ECC Plug-and-Play Overclocking Technology
características principales 16GB (2 x 8GB) Capacity 3600 MHz Clock Speed PC4-28800 288-Pin UDIMM 1.2V @ 2400 MHz | 1.35V @ 3600 MHz 17-21-21 Timings Unbuffered, Non-ECC Integrated Heat Spreader
8 GB SO-DIMM de 260 contactos 3200 MHz / PC4-25600 CL22 1.2 V sin búfer no ECC
16 GB SO-DIMM de 260 contactos 2666 MHz / PC4-21300 CL19 1.2 V sin búfer no ECC
8 GB SO-DIMM de 260 contactos 2666 MHz / PC4-21300 CL19 1.2 V sin búfer no ECC
8 GB DIMM de 288 contactos 3200 MHz / PC4-25600 CL22 1.2 V sin búfer no ECC